(TAISEM, Aa3/AA-/NR)
"*FITCH: US CHIPS INTERVENTION MAY PRESSURE MARGINS" - BBG
"*FITCH: US CHIPS INTERVENTION MAY CREATE INEFFICIENCIES" - BBG
Fitch sees some margin pressure; TSMC impact neutral in our view
Fitch notes that U.S. government investment in Intel may create distorted incentives, driving Intel and its JV partner TSMC (20% owner) to accelerate investments in the Arizona plant prematurely—before next-generation technologies and anchor customers are in place. The agency does not expect large-scale credit deterioration for chip makers but warns these dynamics could create inefficiencies and pressure profitability.
Fitch expects the U.S.-Intel JV to “structurally disadvantage” TSMC’s own U.S.-based foundry (Fab 21), which produces chips one generation behind following Taiwan’s IP protection strategy.
The key differences between Taiwanese fabs and those in the U.S. involve technology and scale. TSMC’s U.S. plants produce previous-generation 4 nm chips to support domestic customers and build strategic capacity, while Taiwanese fabs manufacture leading-edge 3 nm chips— representing a larger scale and global customer base.
In our view, TSMC is unlikely to face major margin declines related to its U.S. JV or operations. TSMC reported strong operating margins of 49.6% in 2Q25 and guided for 45.5%–47.5% in 3Q25.

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Aussie 10-yr futures received a boost from the US Treasury rally that followed both the recent poor NFP print as well as Tuesday’s inflation number. While this impact faded into the close of the week, 10-year futures remain toward the top end of the recent range. To the upside, next resistance is at 96.207, a Fibonacci retracement point. Next support undercuts at 95.420 (pierced), the Feb 13 low, ahead of 95.275, the Nov 14 low and a key support. Clearance of this level would strengthen a bearish condition.